Technical Details

• Features Break-Before-Make
• Package / Case 36-XFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• Applications MIPI
• On-State Resistance (Max) 9Ohm
• -3db Bandwidth 1.9GHz
• Supplier Device Package 36-WLCSP (2.06x2.06)
• Voltage - Supply, Single (V+) 1.65V ~ 4.5V
• Switch Circuit SPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Number of Channels 4
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant