Technical Details

• Package / Case 1760-BBGA, FCBGA
• Speed 1.5GHz
• RAM Size 256KB
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Primary Attributes FPGA - 2800K Logic Elements
• Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA, WDT
• Supplier Device Package 1760-FBGA (42.5x42.5)
• Architecture MCU, FPGA
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected